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Muecas Campbell
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Moisture/Reflow Sensitive Devices: Handling, Packing, Shipping, and Use Guidelines in J-STD-033D (PDF)

What is J-STD-033D and why do you need it?

If you are involved in the manufacturing or use of surface mount devices (SMDs), you may have heard of J-STD-033D. This is a joint standard developed by the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPC. It provides standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075.

j-std-033d pdf download

The purpose of this standard is to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined in this standard provides a minimum shelf life of 12 months from the seal date.

In this article, we will explain how to handle, pack, ship, and use moisture/reflow sensitive devices according to J-STD-033D. We will also show you how to download the pdf file of this standard from the official websites of JEDEC or IPC. Finally, we will compare J-STD-033D with previous versions and highlight some of the changes that have been made.

How to handle, pack, ship, and use moisture/reflow sensitive devices

Moisture/reflow sensitive devices are those that can be damaged by moisture absorption during storage or exposure to high temperatures during solder reflow. These devices are classified into different levels according to their sensitivity, as shown in the table below.


Floor Life




<30C/85% RH


1 year

<30C/60% RH


4 weeks

<30C/60% RH


168 hours

<30C/60% RH


72 hours

<30C/60% RH


48 hours

<30C/60% RH


24 hours

<30C/60% RH


<6 hours*

<30C/60% RH*

* Level * Level 6 devices are not normally stored in the factory and are shipped in a dry state. If exposed to factory ambient, they must be mounted within the time limit specified by the manufacturer. The floor life is the time that the devices can be exposed to factory ambient conditions before they need to be reflowed or resealed. If the floor life is exceeded, the devices must be dried before reflow. The drying requirements depend on the level of sensitivity, the thickness of the device, and the time elapsed since the floor life expired. Dry pack process and materials

The dry pack process is a method of packing moisture/reflow sensitive devices in a moisture barrier bag (MBB) with a desiccant and a humidity indicator card (HIC). The MBB protects the devices from moisture and oxygen, while the desiccant absorbs any moisture that may enter the bag. The HIC shows the relative humidity inside the bag and indicates whether the bag has been compromised or not.

The materials used for dry pack are as follows:

  • Moisture barrier bag: A laminated bag made of polyester, aluminum foil, and polyethylene. It must have a water vapor transmission rate (WVTR) of less than 0.002 g/100 in2/24 hours at 40C/90% RH.

  • Desiccant: A material that can adsorb moisture from the air. It must have a moisture capacity of at least 6 g of water vapor per unit at 20% RH and 40C.

  • Humidity indicator card: A card that changes color when exposed to different levels of humidity. It must have spots for 5%, 10%, and 60% RH.

  • Labels: Labels that indicate the part number, quantity, date code, lot code, seal date, sensitivity level, shelf life, caution statement, and JEDEC registration symbol.

The dry pack process involves the following steps:

  • Place the devices in an antistatic tray or tape and reel.

  • Place one or more units of desiccant in the MBB.

  • Place one HIC in the MBB near the opening.

  • Place the devices in the MBB and fold over the open end.

  • Seal the MBB using a heat sealer.

  • Apply the labels on the MBB.

Some precautions to take when performing dry pack are:

  • Do not fold or crease the MBB.

  • Do not expose the MBB to direct sunlight or high temperatures.

  • Do not puncture or damage the MBB.

  • Do not open the MBB unless ready to use the devices.

The shelf life of dry pack is 12 months from the seal date, provided that the MBB is stored at less than 40C and 90% RH. The shelf life can be extended by baking and resealing the devices.

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Drying methods and considerations

If moisture/reflow sensitive devices are exposed to factory ambient conditions beyond their floor life, they must be dried before reflow to prevent moisture-induced damage. The drying methods vary depending on whether the devices are still sealed in their original MBB or have been removed from it.

If the devices are still sealed in their original MBB, they can be dried by baking them at 40C for a time period that depends on their thickness and sensitivity level. The table below shows some examples of baking times for different levels and thicknesses.


<1.4 mm

>1.4 mm <2 mm

>2 mm


72 hours

96 hours

120 hours


48 hours

72 hours

96 hours


24 hours48 hours72 hours412 hours24 hours48 hours5/5a/6N/A*N/A*N/A*</td </tr * Level 5/5a/6 devices cannot be baked in their original MBB because they will exceed their solderability limitations. If the devices If the devices have been removed from their original MBB, they can be dried by baking them at higher temperatures, such as 125C or 150C, for shorter periods of time. However, there are some considerations to take into account when using this method, such as: - The carrier type: The devices should be placed in a low temperature carrier, such as a plastic tray or tape and reel, that can withstand the baking temperature. Metal carriers, such as JEDEC trays, should be avoided because they can cause uneven heating and thermal stress. - The ESD protection: The devices should be protected from electrostatic discharge (ESD) during baking and handling. The carrier and the oven should be grounded and ESD-safe. The devices should not be touched with bare hands or metal tools. - The reuse of carriers: The carriers used for baking should not be reused for shipping or storage, because they may have absorbed moisture during baking. They should be discarded or marked as "baked only". - The solderability limitations: The devices should not be baked more than once at high temperatures, because they may lose their solderability due to oxidation or intermetallic growth. The maximum cumulative exposure time at high temperatures should not exceed 8 hours for most devices. Use of moisture/reflow sensitive devices

Once the devices are ready to be used, they should be mounted on the board within their floor life. The floor life is reset to zero when the devices are removed from their MBB or when the HIC shows a color change above 10% RH. If the floor life is exceeded, the devices must be resealed or rebaked before reflow.

The reflow profile of the devices should follow the recommendations of J-STD-020 or J-STD-075, depending on the device package type. The peak reflow temperature and time above liquidus should not exceed the limits specified by the device manufacturer. The number of reflow cycles should also be minimized to avoid thermal stress and degradation.

If the devices are not used immediately after opening the MBB, they should be resealed in a new MBB with fresh desiccant and HIC. The resealing process is similar to the dry pack process, except that the seal date and shelf life are not changed. The devices can also be rebaked and resealed if they have been exposed to factory ambient for more than 72 hours.

How to download J-STD-033D pdf file

If you want to download the pdf file of J-STD-033D, you have two options: you can either download it from the JEDEC website or from the IPC website. Both websites require registration and payment before downloading.

To download J-STD-033D from the JE


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